New possibilities in the thermal evaluation, offered by transient testing

After giving the theoretical summary of the structure function method for the evaluation the thermal transient measurement results, the broad applicability of the method is demonstrated by practical examples. The first example shows how to control the quality of the die attachment or soldering of packages with fast transient measurements and subsequent evaluation. The second example presents how can transient testing be used to determine thermal material parameters; e.g. the effective thermal conductivity of printed circuit boards.